Principal Packaging Engineer

At Alpha and Omega Semiconductor (AOS), we design, develop and globally supply a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT, IPM, TVS, GaN / SiC, Power IC and Digital Power products. You will find our products in everyday applications including personal computers, graphic cards, gaming consoles, TVs, home appliances, smart phones, power tools, and more! At the center of our innovation is our people who bring passion, talent, and a collaborative atmosphere to our growing company. We offer an impressive benefit package and career development opportunities. If you are ready to take the next step in your career working with a team of passionate and talented people, then take a look at the job opportunity below to POWER your career!

Overall Purpose of Position : To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.

P rimary Job Responsibilities / Duties :

• Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
• Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP
• Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.

Qualifications :

Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, age, color, ethnicity, marital status, sex, religion, national origin, sexual orientation, gender, gender identity, disability, protected veteran status or any other category protected by federal, state or local law.

Job Posted by ApplicantPro