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DMTS Process Integration Engineer - Advanced Packaging | Micron, Boise
DMTS Process Integration Engineer - Advanced Packaging | Micron, BoiseNanoHelp • Boise, ID, US
DMTS Process Integration Engineer - Advanced Packaging | Micron, Boise

DMTS Process Integration Engineer - Advanced Packaging | Micron, Boise

NanoHelp • Boise, ID, US
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DMTS Process Integration Engineer – Advanced Packaging | Micron, Boise

Micron Boise is hiring a Process Integration Engineer to lead integration strategies for advanced memory packaging. Shape 3DIC, hybrid bonding, and FO-WLP innovations in next-gen nanotechnology.

Job Details

  • Title

DMTS Process Integration Engineer – Advanced Package Technology Development (APTD)

  • Organization

    • Micron Technology, Inc.

  • Work Location

    • Boise, Idaho, USA

  • Research Field

    • Nanotechnology, Electronics, Materials Engineering, Electrical Engineering, Mechanical Engineering

  • Funding Info

    • Industry-funded (Micron)

  • Application Deadline

    • Rolling

  • Posted Date

    • July 2025

  • Country

    • United States

    Required Qualification

    MS or PhD in Engineering, Physics, Chemistry, or related fields

    Required Experience

    Experience in DRAM / NAND / 3DIC, hybrid bonding, integration, and yield optimization

    Salary Details

    Competitive with US-based benefits

    Key Responsibilities

  • Lead process integration efforts in 3DIC, hybrid bonding, FO-WLP, and other packaging innovations
  • Develop line monitoring methods, yield improvement plans, and statistical process controls
  • Design and analyze experiments (DoEs) using advanced analytics and system tools
  • Drive cross-site project coordination, communication, and technology transfer
  • Mentor early-career engineers, lead KT problem-solving, and contribute to training sessions
  • Define contingency plans, build integration flows, and align direction with global teams
  • Present findings across teams and publish ECN and change documentation
  • Translate design goals into process innovation across integration domains

    • Required Qualifications

  • MS or PhD in Electrical, Mechanical, Materials, Computer Engineering, Physics, or Chemistry
  • Strong background in Advanced Packaging, DRAM, NAND, 3DIC, hybrid bonding, or FO-WLP
  • Proficiency in data analysis, JMP / system tools, and process diagnostics
  • Leadership and communication skills across cross-functional R&D and manufacturing teams
  • Adaptability in dynamic, high-tech environments

    • Micron offers a collaborative, innovation-first culture with robust benefits including healthcare plans, paid time off, global learning opportunities, and long-term career development.

    Micron is an equal opportunity employer and does not charge candidates any fees. AI-assisted resumes are welcome but must reflect accurate experience. Misrepresentation may lead to disqualification. All applications are subject to Micron's equal opportunity and labor compliance policies.

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    Packaging Engineer • Boise, ID, US

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