Overview
We are seeking a highly experienced and innovative Mechanical and Hardware Systems Architect to lead the design and development of advanced mechanical and thermal solutions for cutting-edge products and platforms at HP UK . This role involves overseeing multiple project teams, collaborating with internal and external partners, and driving strategic initiatives in component design and integration.
Responsibilities
- Lead cross-functional teams through all phases of mechanical and thermal development, including concept design, validation, tooling, and testing.
- Foster and manage strategic relationships with internal stakeholders and outsourced development partners to ensure high-quality mechanical design execution.
- Review and assess design outputs and project deliverables for compliance with engineering standards and best practices, providing actionable feedback to enhance product quality.
- Drive technical decision-making and serve as a subject matter expert in material, manufacturing mothods, DFM / DFA, thermal / mechanical analysis and system integration
- Champion the adoption of emerging technologies and innovative design methodologies within the mechanical and thermal engineering domain.
- Define and drive the strategy for key mechanical components such as touch interfaces, keyboards, and connectors.
- Evaluate vendors and manufacturing processes; participate in supplier development.
- Contribute to long-term product strategy and R&D efforts
- Mentor and guide junior engineers, fostering a culture of technical excellence and continuous improvement.
Qualifications
Bachelor's or master's degree in mechanical engineering.8–12 years of experience in mechanical design, preferably in notebook, Tablet, mobility, or AR / VR product, or other consumer electronics development.Proficiency in 3D CAD tools such as Creo or equivalent.Experience with FEA and thermal / structural simulationsExperience with mechanical architecture and structural design, including material science, thermal design management, hardware integration, and their associated design constraints in electronic system structures.Strong analytical and problem-solving skills with a deep understanding of mechanical and thermal architecture in electronic systems.Familiarity with design for manufacturability and a range of manufacturing processes (machining, injection molding, die casting, sheet metal)Exceptional communication skills with the ability to articulate complex design concepts and influence senior leadership.Compensation and Benefits
The pay range for this role is $104,800 to $158,250 USD annually, with additional opportunities for pay in the form of bonus and / or equity (applies to United States candidates only). Pay varies by location, knowledge, skills, and experience.
Benefits
Health insuranceDental insuranceVision insuranceLong term / short term disability insuranceEmployee assistance programFlexible spending accountLife insuranceGenerous time off policies, including 4-12 weeks fully paid parental leave based on tenure11 paid holidaysAdditional flexible paid vacation and sick leaveJob Details
Job function : Management and ManufacturingEmployment type : Full-timeSchedule : Full timeShift : No shift premium (United States)Travel : 25%Relocation : YesEqual Employment Opportunity
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable laws. If you disclose information requested, you will not be subject to adverse treatment; this information is provided voluntarily and will be kept confidential. For more information on HP's EEO policy, visit Equal Employment Opportunity is the Law.
Seniority level
Mid-Senior levelJ-18808-Ljbffr