Thin Film Process Development Engineer (Writer) Job at Headway Technologies in M

Overview Thin Film Process Development Engineer (Writer). Location : Milpitas, CA. Salary range : $120,819.00 - $177,675.00 per year + bonus target + benefits. This position reports to the Director, Thin Film Process Development Engineering.

Under the direction of the Director of Thin Film Process Development Engineering, the Thin Film Process Development Engineer is responsible for developing, monitoring, sustaining, and supporting advanced writer film, PMR, TAMR or other sensor processes for new and prototype products; designing and conducting advanced wafer experiments, analyzing the data, and reporting the results; developing and implementing new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions.

Responsibilities Develops, sustains, and supports advanced thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize PMR, TAMR and advanced writer processes

Develops and implements practices or methodologies which reduce cost and improve operational efficiency

Conducts root cause analysis and implements corrective action if required

Develops and implements processes or procedures for transitioning new products into the production line

Resolves process issues related to material selection; recommends corrective action

Reviews, updates, and maintains documentation and process instructions

Instructs operators and technicians on processes and procedures, including modifications to existing procedures

Partners with equipment and maintenance personnel to minimize tool downtime and integrate new tools into the production line

Designs and conducts advanced experiments, analyzes data, and develops recommendations for improving performance or reducing cost based on test results

Collaborates with process and product engineering and other groups to develop and implement new processes which reduce scrap and improve yield

Responds to inquiries from team members, managers, or departments

Adheres to all safety policies and procedures

Performs other duties of a similar nature or level as required

Qualifications Master’s degree in Electrical Engineering, Materials Science, or Physics, and / or equivalent relevant experience; PhD preferred

Three years of hands-on experience in PVD / IBD / CVD / ALD / PECVD technology

Strong industry experience in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering role

Strong knowledge and experience using JMP, SPC, or similar software

Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities Strong knowledge and experience of PVD, IBD, CVD, ALD, PECVD processes in PMR, TAMR, and other writer areas

Strong knowledge of thin film manufacturing processes, practices, and techniques

Strong knowledge of wafer fabrication processing techniques and tools such as PVD, IBD, CVD, ALD, and PECVD

Ability to use Microsoft Office to create spreadsheets, documents, and presentations

Ability to design experiments, analyze results, and recommend corrective action to reduce scrap and improve yield

Strong critical thinking to resolve issues, perform root cause analysis, and propose process improvements

Effective communication skills, both verbal and written, with all levels of staff and management

Ability to work collaboratively across levels of employees and management

Commitment to safety policies and procedures

Strong organizational and time management skills

Problem-solving and troubleshooting skills

Flexibility and ability to prioritize

Working Conditions Works primarily in an office environment; schedule may vary to meet business needs. May travel between sites. May work in a class 100 ESD-sensitive wafer fab environment and wear appropriate safety attire. May be exposed to hazardous chemicals, fumes, or vapors and loud noises in the wafer manufacturing facility. Occasional lifting of 20 pounds or more.

DDK / Headway Technologies, Inc. is an equal employment opportunity employer. Applications from all qualified individuals are welcome without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.

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