Job Description
Job Description
Rochester Electronics is immediately hiring for a Senior Engineering Technician! .
At Rochester Electronics, we create an excellent employee experience focused on value, performance, motivation, recognition, and career growth. Many companies say their employees are their most important asset. At Rochester Electronics, we mean it!
- Outstanding low-cost medical, dental, vision, and prescription drug coverage, Rochester pays 92% of the premiums on behalf of its full-time employees
- Paid time off, including holiday
- Generous match 401K program
- Tuition reimbursement
- Flexible spending account
And so much more!
For the last 40 years, Rochester Electronics, in partnership with over 70 leading semiconductor manufacturers, has provided our valued customers with a continuous source of critical semiconductors. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester can manufacture over 70,000 device types.
General Summary
Failure Analysis technician to perform debug, fault isolation, and root cause analysis of prototype and production devices.
Responsibilities
Perform electrical verification and fault isolation on highly complex ICs (Analog, Digital, ASICs, Microprocessors, etc.) in package, die, or wafer form to determine the failure mechanism. Basic understanding of FA tools with regular supervision and moderate to high levels of oversight.Replicate ATE test data on the manual FA bench using ATE datalogs, product datasheets, curve tracers, parametric analyzers, AC / DC test equipment, and collaborate with product and test engineers. Works on basic routine assignments with quality mindset.Ability to gather and interpret PEM (photon emission microscopy) and Thermal hot spot data and drive to the correct failure location using optical layout photos or CAD assisted design data.Perform material characterization of the failure mechanism (SAM, X-ray, SEM, EDS, x-sections, etc.) to assist with root cause analysis.Perform decapsulation of various packages including hermetic and plastic molded packages utilizing various techniques such as chemical, laser and mechanical methods.Perform deprocessing of die or wafers using a combination of chemical, mechanical or RIE etching. Must be able to work with caution and safety in mind while working with chemicals and physical de-processing with an attention to detail.Works closely with the Mfg. organization, Assembly, Product, and Test Engineering to understand the organizations goals and help them meet all requirements and deadlines, by turning around FA requests in a timely manner.Work in a hands-on position where the individual will be doing some of their work on an independent basis.Perform installations of FA equipment and coordinates maintenance and testing procedures to ensure proper working order of FA tools.Effectively write and maintain Failure Analysis Lab procedures. Effectively compile comprehensive DPA construction analysis reports.Identify and address potential areas for improvement including tools, cycle time, utilization and cost.Must be able to able to handle several active projects at one time (multitask) with limited assistance or instruction.Qualifications
Education : 2 year degree in electronics, microelectronics, or related degree.Experience : none required, FA or Lab experience is a plus.Proven skills :Basic knowledge of semiconductor products, device layout, and process technologies.
Basic knowledge and understanding of analog, mixed signal, Asic, and power semiconductor operation.Basic understanding of device physics and semiconductor fabrication techniques.Must be organized, detail oriented, had have solid problem solving skills.Ability to work independently with moderate supervision. Driven to achieve goals in a fast-paced customer service environment.Effective verbal and written communications skills, with ability to effectively communicate with peers and customers. Follow written and verbal instruction with moderate supervision. Communicate information clearly and concisely and listen attentively to others.Ability to work within a team and as an individual contributor with a little independent autonomy in a fast-paced, changing environment.Collaborate with cross functional teams (ASL, MFG, QA, REL, Test) to solve basic electrical and materials analysis investigations of semiconductor integrated circuit failures.Rochester Electronics is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability status, age, veteran status, or other characteristics protected by applicable law. Rochester Electronics is committed to a culturally diverse workforce.
