Hybrid manufacturing of novel RF electronic circuits

Hybrid manufacturing of novel RF electronic circuits

Join to apply for the Hybrid manufacturing of novel RF electronic circuits role at ORAU

About the Research

Model and simulate useful 3D RF structures intended for manufacturing on direct-write tools with integrated pick-and-place and milling capabilities. The project requires testing, verification, and optimization of RF structures using simulations such as HFSS. Knowledge of manufacturing volumetric circuits is essential.

Organization

DEVCOM Army Research Laboratory

Reference Code

ARL-C-SEDD-300097

Description

Model and simulate useful 3D RF structures intended for manufacturing on direct-write tools with integrated pick-and-place and milling capabilities. The project will involve testing, verification, and optimization of RF structures using simulations like HFSS. Knowledge of manufacturing volumetric circuits is required.

Keywords

3D printed circuits, Hybrid circuits, 3D slicing, RF testing, RF simulation

Application Requirements

• Curriculum Vitae or Resume
• Three References Forms (including contact info for individuals familiar with your qualifications)
• Transcripts verifying degree completion (student / unofficial copies accepted)

If selected, you will need to submit a research proposal related to a specific opportunity at ARL, outlining your research plan, objectives, background, and timeframe.

Eligibility Requirements

Additional Information

Position Type : Internship, Full-time

Job Functions : Management and Manufacturing

Industry : Government Administration

Referrals can increase your interview chances. Notifications available for similar manufacturing jobs in Adelphi, MD and nearby locations.

For questions, contact : ARLFellowship@orau.org

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