Electrical Engineer Lead

Description

Leidos currently has an opening for an Electrical Engineer Lead to lead the design, development, and implementation of space based sensors for our customers at Leidos' San Diego offices.

As an Electrical Engineer Lead you will work closely with the Chief Engineer, Lead FPGA / Firmware Engineer, Lead Signal Processing Engineer, Lead Software Engineer, Production, and Manufacturing.

Additionally, as an Electrical Engineer Lead, you will oversee a team of 3-5 Electrical Engineers in developing space based sensor products.

The selected individual will have deep domain knowledge, experience with and program managing capabilities to design, develop, integrate, and test high-speed printed circuit boards for system-on-chip (SoC).

It is expected for the candidate to perform a wide range of functions to include, hardware design, firmware development, system integration, and test.

The selected individual must possess solid experience, strong understanding, and expert domain knowledge, of prototype circuit design, small form factor PCBs, and SoC components hardware for use in embedded systems.

This includes field programmable gate arrays (FPGA), digital signal processors (DSP), and data converters. The potential candidate must also possess a strong background in circuit board testing solution and analysis, that includes power, thermal, mechanical testing procedures, test setup, and unique special test equipment.

Primary Responsibilities

This position will be responsible for managing the overall development, integrating, troubleshooting, and supporting hardware Electrical Engineering activities for space-related systems and sensors.

Primary responsibilities will include managing a team of electrical engineers, developing and decomposing requirements, identifying opaque requirements, verification requirements management, integration and interface activities, documentation of design and development plans, decomposing and developing test requirements, technical performance metrics, and developing test artifacts for the execution of testing.

Some additional responsibilities include :

• Interface with technical management and execution of engineering activities requirements analysis, implementation planning, integration and test, documentation, deployment, and system assessment.
• Work closely with the electrical engineers, signal processing, mechanical, and test engineers, to convey sensor design architectural details, software message interactions process flows, hardware placement design, and firmware control interfaces.
• Work closely with a team of software, firmware, and systems engineers to ensure Leidos' PCBs meet product requirements.
• Proven experience providing technical solutions, guidance and oversight throughout the development process to include supervising design, layout, procurement, assembly, fabrication, and test.
• Experience resolving complex issues related to approaches, requirements, specifications and design.
• Experience designing and integrating high-speed circuit boards to support a diverse array of FPGA applications.
• Experience developing and releasing trade studies for part and architecture decisions.
• Experience developing and shaping hardware specifications.
• Experience sizing FPGAs, and / or SoCs for signal processing algorithm implementation.
• Attend regular customer meetings and lead technical discussions / program reviews to support federal government customers.
• Create product documentation and technical reports to include system requirements specifications, interface control documents, hardware description documents, test reports, and design reviews.

Basic Qualifications (Mandatory)

• Experience with managing a team of Electrical Engineers.
• Experience working on a cross-functional team (PCB layout, mechanical engineering, manufacturing, and quality engineering) to facilitate the design process.
• Experience with digital hardware design, PCB technology, and RF components including ASICs, FPGAs, and data converters.
• Experience with PCB design and layout along with associated tools and CAD packages.
• Experience with FPGA design, Microchip, and / or Xilinx.
• Knowledgeable of high-speed communication bus design and layout techniques such as USB, PCIe, XFI, DDR
• Experience developing FPGA firmware and embedded test software.
• Experience developing test plans, executing validation and test procedures, evaluating test results, performing analysis, and writing technical reports.
• Experience with embedded signal processing algorithms, simulations, models, and / or software for deployment on complex SoCs.
• Knowledge of various hardware and debugging equipment, oscilloscopes, logic analyzers, and spectrum analyzers
• B.S. degree in Computer Science, Engineering, Physics, Mathematics, or related field and 12+ years of prior relevant experience or M.

S. degree with 10+years of prior relevant experience

• Able to obtain a secret security clearance with the ability to ascertain a Top Secret Clearance.
• 10% travel to customer / subcontractor sites as required.

Preferred Qualifications (Optional)

A preferred candidate would also possess sound knowledge of space concepts as well as a good understanding of algorithm implementation and hardware / software implementation.

• Space-based influences (e.g., curvature of the earth, clutter, radiation, etc) as it impacts sensor accuracies.
• Master's degree or higher in Electrical / Computer Engineering.
• Strong understanding of fundamentals with modeling and simulation and / or algorithm development.
• Programming experience in C / C++, Java, Visual Basic, Python, or MATLAB.
• Background in FPGA / SoC security to include anti-tamper, secure boot.

Original Posting Date : 2024-07-24While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range : Pay Range $122,200.00 - $220,900.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.

About Leidos Leidos is a Fortune 500® innovation company rapidly addressing the world's most vexing challenges in national security and health.

The company's global workforce of 47,000 collaborates to create smarter technology solutions for customers in heavily regulated industries.

Headquartered in Reston, Virginia, Leidos reported annual revenues of approximately $15.4 billion for the fiscal year ended December 29, 2023.

For more information, visit www.Leidos.com .

Pay and Benefits Pay and benefits are fundamental to any career decision. That's why we craft compensation packages that reflect the importance of the work we do for our customers.

Employment benefits include competitive compensation, Health and Wellness programs, Income Protection, Paid Leave and Retirement.

More details are available here .

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e., ask you for money), nor will Leidos ever advance money as part of the hiring process (i.e., send you a check or money order before doing any work).

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Commitment to Diversity All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law.

Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.