If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.
Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time .
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.
We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Job Description
We are looking for a Semiconductor Packaging Winter / Spring Co-Op to join the team in Irvine, CA for a 6 month period starting in January, 2025!
The Co-Op will be responsible for supporting the Packaging team with activities such as performing DPA (Destructive Physical Analysis), analyzing assembly data, generating data summary reports, and helping to summarize as well as draw conclusions from the data.
They will also help work on New Technology Introduction (NTI) qualification activities such as executing the DoE plan and performing Reliability early look data collection.
The Packaging Intern will work closely with engineers across multiple functional teams, such as quality / reliability engineers, NPI engineers, Component engineers and Mexicali factory colleagues to develop next generation packaging technology and support trouble shooting mass production issues.
Job responsibilities
- Preparing cross-section samples for DPA validation
- Drafting engineering build requests in Skyworks assembly facility
- Generating assembly build report
- Executing NTI qualification DoE, coordinating data collection, and performing data analysis
Key qualifications
- Pursuing BS or MS program for Mechanical Engineering, Material Science, Electrical Engineering, Physics, or other relevant specialization from an accredited 4-year university
- Basic knowledge of IC packaging is preferred
- Hands on experience on operating optical microscope and SEM / EDX instrument
- Able to prepare cross section sample for SEM / EDX analysis ( on job training will be provided)
- Understanding of engineering documents and specifications
- Excellent written and verbal communication skill, interpersonal skill and presentation skill
- Strong data analysis skills
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