Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Requisition ID : R10170567

Please double check you have the right level of experience and qualifications by reading the full overview of this opportunity below.

Category : Engineering

Location : Baltimore, Maryland, United States of America

Clearance Type : Secret

Telecommute : Yes-May consider hybrid teleworking for this position

Shift : Days (United States of America)

Travel Required : Yes, 10% of the Time

Relocation Assistance : Relocation assistance may be available

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.

Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.

Northrop Grumman Mission Systems is seeking a Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals.

This position will be located in Linthicum, Maryland.

Overview :

You will work as part of a cross-functional team responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems.

You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.

This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.

This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher and contract award.

Roles and Responsibilities include :

Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs).

Collaboration within a cross-functional Integrated Product Team (IPT); effective communication with peers in adjacent functions.

Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.

Providing technical leadership and mentoring to less experienced personnel.

Basic Qualifications for Principal Mechanical Electronic Packaging Engineer :

Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.

U.S Citizenship with the ability to obtain / maintain an active DoD Secret Clearance.

Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate / PWB layout.

Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.

Proficient with AutoCAD.

Familiarity with NX or other 3D modeling software.

Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer :

Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.

U.S Citizenship with the ability to obtain / maintain an active DoD Secret Clearance.

Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate / PWB layout.

Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.

Proficient with AutoCAD.

Familiarity with NX or other 3D modeling software.

Preferred Qualifications :

Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.

Active DoD Secret Clearance or higher.

Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.

Familiarity with thermal and structural analysis considerations, methodologies, and software tools.

Experience with hands-on assembly and testing of prototype electronic hardware.

Experience in a technical leadership role on a cross-functional product development team.

This positions standard work schedule is a 9 / 80. The 9 / 80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.

As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including :

Medical, Dental & Vision coverage.

401k.

Educational Assistance.

Life Insurance.

Employee Assistance Programs & Work / Life Solutions.

Paid Time Off.

Health & Wellness Resources.

Employee Discounts.

Salary Range : $93,000 - $139,600

Salary Range 2 : $115,400 - $173,200

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity / Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.

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