Requisition ID : R10171710
Find out more about the daily tasks, overall responsibilities, and required experience for this opportunity by scrolling down now.
Category : Engineering
Location : Linthicum, Maryland, United States of America
Clearance Type : Secret
Telecommute : No- Teleworking not available for this position
Shift : 1st Shift (United States of America)
Travel Required : Yes, 10% of the Time
Relocation Assistance : Relocation assistance may be available
Positions Available : 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.
Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history.
We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.
Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
The Northrop Grumman Microelectronics Center (NGMC) is seeking an exceptionally talented, motivated, and creative Plasma Etch Process Engineer for our Advanced Technology Lab (ATL) located outside of Baltimore, Maryland.
The candidate must be a strong team participant, have excellent communication skills, and be resourceful and multitalented.
A strong understanding of semiconductor technology, metrology processes, and equipment engineering is essential.
The Plasma Etch Process Engineer will be responsible for but not limited to :
All aspects of process development, optimization and ownership of Plasma Etch processes for semiconductor manufacturing.
Interfacing with other unit process engineers and product integration engineers to develop plasma etch processes.
Supporting statistical process control (SPC) and continuous improvement efforts.
Establishing standard operating procedures and engaging the operations team to ensure these are followed.
Responsible for the procurement and start-up of new process equipment and processes.
Performs all other related duties as assigned.
Basic Qualifications Principal Plasma Etch Process Engineer :
Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 5 years technical related experience in semiconductor fabrication.
Understanding of semiconductor Plasma Etch processes.
Able to work independently with hands-on experience in operating tools, gathering, and analyzing data.
Good interpersonal and communication skills, both written and verbal.
US citizenship required.
Must be able to obtain and maintain a Secret Clearance.
Basic Qualifications Senior Principal Plasma Etch Process Engineer :
Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 8 years technical related experience in semiconductor fabrication.
Development and optimization of plasma etch processes.
Able to work independently with hands-on experience in operating tools, gathering, and analyzing data.
Good interpersonal and communication skills, both written and verbal.
US citizenship required.
Must be able to obtain and maintain a Secret Clearance.
Preferred Qualifications :
Process development experience in Plasma Etching.
Experience in superconductor microelectronics.
Experience in lean manufacturing practices.
User of various software packages commonly found in Semiconductor Wafer Fabs.
Active Secret Clearance.
Salary Range : $102,400 - $153,600
Employees may be eligible for a discretionary bonus in addition to base pay. Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, paid time off (PTO), and more.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity / Affirmative Action Employer.
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