_Technician: Engineering Laboratory - II
100% onsite
Laptop will be issued
Long term, plan to extend.
open to local candidates, not wiling to entertain candidates looking to relocate.
Do not submit same candidates presented to JP26016 prior, same sponsor. Teams video interview.
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Skill sets required not limited to the following :
Demonstrated skills in X-section / planar polishing, Optical microscopy imaging, and SEM / EDX on printed circuit board are preferred.
Knowledge of packaging material property and behavior is beneficial.
Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
Minimum educational qualification is an AS degree in science or engineering and 2-4 years experience in failure analysis, material analysis, process development or analytical tool development.
Must be able to stand and work for at least 6 hours.
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