Semiconductor Wet Etch Process Engineer (Palm Bay, FL)

Job Title : Semiconductor Wet Etch Process Engineer (Palm Bay, FL)Job Code : 14732Job Location : Palm Bay, FL Job Description : L3Harris Technologies is seeking a Semiconductor Wet Etch Process Engineer for our Palm Bay, FL location.

As a Semiconductor Wet Etch Process Engineer in the Microelectronics Division, you will support wet etch tools and processes, perform data analysis for development and production work, identify process issues and process optimization opportunities, perform root cause analysis and drive mitigation strategies, perform qualification activies for new processes and tools, and provide sustaining engineering support in a manufacturing area.

You will have regular interactions with equipment vendors, operations management, and a variety of engineering teams. This role may provide relocation assistance to the selected candidate(s) if minimum requirements are met.

• Essential Functions : Qualify, setup, and operate semiconductor wet etch and cleans equipment in a manufacturing cleanroom environmentPerform DOEs and process verification to bring new tools and processes onlineDevelop, optimize, and own wet etch and cleans processes to drive device performance and yield improvement;
• create process documentationCreate and routinely monitor statistical process control (SPC)Identify process drifts and catch potential excursions Document out of control action plans (OCAPs) for processes failing SPC limitsIdentify process and / or equipment issues;

Lead investigation efforts for issues related to inline thin film processingRecommend improvements for efficiency, cost, reliability and quality of existing productsWork with related integrated teams to drive, test, and implement approved plansPerform on-the-job training for incoming new hires as the team growsMaintain a safe and organized work environment Qualifications : Bachelor’s Degree and minimum 6 years of prior relevant experience.

Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related experience.

4+ years’ experience in semiconductor wafer manufacturing operationsPrevious experience in advanced packaging and / or wafer-level processingAbility to Obtain Top Secret / SCI w / Poly Preferred Additional Skills : Active Top Secret ClearanceExcellent communication and interpersonal skills to collaborate effectively with diverse teams.

Must have computer skills including MS Windows and Office products (Excel, PowerPoint, Word, and Project)Strong sense of responsibility, ownership, and follow-throughMust be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goalAbility to lead teams, train, and mentor personnelLean Six Sigma CertificationExperience working in classified government programsPrevious experience working in a Class 100 cleanroomPrevious experience using commercial Manufacturing Execution Systems (MES)Previous experience with semiconductor wet etch equipment and benchtop processesPrevious experience with semiconductor wet etch processes including process development, new product introduction, and SPC parameter setupExperience in implementing lean / six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause / corrective action analysis)