Job Details
About Us
The is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions.
Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.
S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc.
We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.
TIE is part of the at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century.
With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.
S. universities, Texas Engineering has launched some of the nation’s most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care.
Situated in the heart of Austin named America’s Coolest City by Expedia and The Best Place to Live in the U.S. by U.S. News and World Report the Cockrell School embodies the city’s innovative spirit.
Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders.
At UT Austin, we say What starts here changes the world. As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research.
Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs.
UT Austin, recognized by Forbes as one of , provides outstanding and packages that include :
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds
Additional Voluntary Retirement Programs : Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets.
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
General Notes
Multiple vacancies are available. This position may be filled at a higher-level title, relative to the experience and qualifications of the selected candidate.
Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship. Relocation assistance may be available.
Purpose
- Provides professional expertise to the Texas Institute for Electronics in one of the following focus areas : Product Validation;
- Product Test and / or BIST (Built-In-Self-Test). DFT / DFM (Design for Test / Design for Manufacturing); Product Reliability;
or Failure Analysis, Yield Improvement, Data analytics. Responsible for optimizing manufacturing processes to improve 3DHI yield, performance, & reliability of a wide range of customer heterogenous micro-systems and test vehicles.
Work closely with design teams to define and create test structures and methodologies to drive our product objectives as we build up our 3DHI manufacturing facility our country can rely upon.
Responsibilities
Micro-system and interconnect process development test vehicle electrical, mechanical, and thermal validation.
Help develop manufacturing & test workflows, 2.5D / 3D modeling methods, BKM’s (Best Known Practices) to comprehend and optimize Power / Thermal / Mechanical / Signal Integrity / RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.
Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices.
Develop and support TIE's 3D-ADK (Assembly Design Kit).
Interpret fab metrology, defect, E-test, and yield process data, silicon-to-simulation analysis versus variability targets, layout effects, design rule assessments, and product parametric correlation to electrical monitor structures to find innovative product / process solutions and optimize product yield, performance, and reliability.
Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements.
Design and execute experiments to evaluate and optimize packaging performance, reliability, and manufacturability / yield.
Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement.
Required Qualifications
Product Engineer I : Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field.
Product Engineer II : Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field and a minimum of three years of relevant industry experience.
Senior Product Engineer : Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field and a minimum of ten years of relevant industry experience.
Strong understanding of semiconductor device physics
Experience driving corrective actions across cross-functional teams to fix and root-cause systematic yield and reliability issues.
Excellent analytical and problem-solving skills, as well as attention to detail
Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.
Ability to thrive in a fast-paced environment and manage multiple projects simultaneously.
Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level packaging, and 3D integration a plus
Prior experience in semiconductor design, product engineering, manufacturing, Test, or packaging a big plus.
Experience conducting data analysis of foundry WAT data, ATE test data using tools like JMP, Python, C+ / + etc a plus.
Preferred Qualifications
Master’s degree or Doctoral degree in semiconductor engineering fields such as Electrical Engineering, Chemical Engineering, Materials Science, or other relevant disciplines.
Prior experience in semiconductor design, product engineering, manufacturing, Test, or packaging.
Strong programming skills in languages such as Python, MATLAB, or C / C++ for simulation, data analysis, and automation.
Experience in a startup or research and development (R&D) environment.
Salary Range
Product Engineer I : $80,000 + depending on qualifications
Product Engineer II : $100,000 + depending on qualifications
Senior Product Engineer : $160,000 + depending on qualifications
Working Conditions
Work is performed on-site in a scientific research environment, with dynamic work conditions and frequent interruptions.
Work outside standard office hours could be required on an occasional basis during peak periods and special events.
Required Materials
Resume / CV
3 work references with their contact information; at least one reference should be from a supervisor
Letter of interest
Important for applicants who are NOT current university employees or contingent workers : You will be prompted to submit your resume in the first step of the online job application process.
Then, any additional Required Materials will be uploaded in the My Experience section; you can multi-select the additional files or click the Upload button for each file.
Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.
Important for Current university employees and contingent workers : As a current university employee or contingent worker, you MUST apply within Workday by searching for Find Jobs.
Before you apply though, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile.
This information will be pulled in to your application. The application is one page and you will need to click the Upload button multiple times in order to attach your Resume, References and any additional Required Materials noted above.
Employment Eligibility :
Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers.
Staff who are promotion / transfer eligible may apply for positions without supervisor approval.
Retirement Plan Eligibility :
The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length.
Background Checks :
A criminal history background check will be required for finalist(s) under consideration for this position.
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