Hardware Engineer - Process Engineer SIP Assembly

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Job Description : Description :

Description :

Join this team focusing on RF modules for the cellular and wireless data markets. You will be part of the Packaging Product Support team within the Wireless Semiconductor Division (WSD) of Broadcom.

You will be working primarily in the prototype assembly lab to participate in all SIP module build operations, develop, improve and troubleshoot SIP assembly processes, support machine PM execution, arrange facility works, and update daily build status.

Responsibilities :

• Become a process owner of many specific SIP assembly processes, primary wirebond and Datacon die attach.
• Backup the operation activities of other SIP assembly processes and oversee entire SIP assembly process flow
• Work in the prototype lab to participate in all SIP module build including hands-on machine programing and operations.

After hours and weekend support are required occasionally

• Work with each process owners to develop, improve, and troubleshoot SIP assembly processes
• Initiate new equipment and process evaluation and buyoff plan
• Collaborate with R&D, QRE / NPI / FA teams on yield and quality issues. Investigate the root causes, trigger corrective actions and improvement plan and verify the effectiveness in the lab
• Initiate, lead and manage continuous process / yield improvement projects with process owners
• Work with each process owners to arrange and execute machine PM and keep spare parts of each machine to prevent machine downtime
• Arrange facility work, communicate with facility manager and team to resolve CDA, DI water, power issues to keep the lab in good operation condition
• Manage the floor plan, facility requirement, moving logistic for the new machine installation
• Join the weekly build plan meeting. Update daily build status. Response to all build status inquiries
• Perform design review and conduct Design for Manufacturability (DFM) and design rule optimization
• Work with packaging engineers on packaging and product development
• Create package drawings, specifications, reports, and production documentation using Cadence and AutoCAD

Requirements :

• Bachelor’s degree in Mechanical / Materials / Chemical and related engineering field
• 0 to 2 years of experiences in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation, shielding...etc.)
• Hands on experiences wirebond, Datacon die attach, and other SIP assembly processes including machine programing and operations
• Solid technical understanding of full range of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms and analytical techniques
• Understanding of statistics, control methodology, DOE, troubleshooting and problem solving techniques
• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
• Good project leading, communication and presentation skills
• A great team member
• Experience on AutoCAD is a plus
• After hours and weekend support are required occasionally
• Willingness to travel for training and machine buy-off

Additional Job Description :

Compensation and Benefits

The annual base salary range for this position is $66,000 - $105,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package : Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.