Sr Specialist, Mechanical Engineer - Electronic Packaging

L3Harris is dedicated to recruiting and developing diverse, high-performing talent who are passionate about what they do.

Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success.

Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.

L3Harris Technologies is an agile global aerospace and defense technology innovator, delivering end-to-end solutions that meet customers’ mission-critical needs.

The company provides advanced defense and commercial technologies across space, air, land, sea and cyber domains. L3Harris has approximately $18 billion in annual revenue and 50,000 employees, with customers in more than 100 countries.

Job Title : Senior Specialist, Mechanical Engineering - Electronic Packaging

Job Code : 14416

Job Location : Palm Bay, FL

Job Description :

Seeking an Electronic Packaging / Mechanical Engineer with a minimum of 8 years of experience to work with a cross-functional team to develop Avionics systems Electronic Packaging.

The position will follow the product from conceptualization through hardware integration and testing, and will interface with Designers, Thermal / Structural Analysts, Systems Engineers, as well as other engineering disciplines, Program Managers, and customer counterparts.

The position will require performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of product to the specification requirements typically with stringent technical, schedule, and process requirements.

Essential Functions :

• Work closely with cross-functional teams in the development of new solutions.
• Strong engineering fundamentals and analytical background with the ability to understand and guide analyses and offer solutions related to mechanical, electro-mechanical, and opto-mechanical systems.

Types of analysis include thermal, fluid, structural, and power.

• Create complex mechanical designs and execute layouts for multiple products
• Demonstrated ability in packaging electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments including ground & avionics
• Demonstrated ability in developing, integrating, and validating mechanical, electro-mechanical and opto-mechanical designs
• Lead the mechanical design, prototyping, testing, and troubleshooting of designs
• Lead the development of relevant design control documentation
• Lead the development and implementation of test protocols for both informal and formal design testing
• Lead the development of written assembly and test procedures for new designs
• Lead in the generation of technical content for bids : scope capture, requirements development, materials pricing, and labor estimates as required
• Aptitude and willingness to lead, train, and mentor junior engineers
• Interact with outside vendors to source parts
• Experience in the design of additive manufactured parts, machined parts, weldments, sheet metal parts, and cable assemblies

Qualifications :

Bachelor’s Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience.

In lieu of a degree, minimum of 10 years of prior related experience.

• Experience with electronics packaging
• CAD experience including PTC CREO / Windchill
• Experience with standard ASME Y14.5M-1994 and GD&T
• Experience with MS Office suite

Preferred Additional Skills :

• Design for Manufacturability and Assembly (DFM / DFMA) experience
• Experience with machined part design
• Experience with plastic and / or sheet metal part design
• Experience with EVMS cost and schedule practices
• Experience with ruggedizing for space and associated analysis (durability analysis, venting analysis, etc.)
• Familiarity with design for space environments (radiation, ATOX, outgassing, etc.)
• Familiarity with hermetic package design a plus
30+ days ago