Senior Staff Packaging Engineer
Wise Skulls llc
San Jose, USA
Full-time
Title : Senior Staff PackagingEngineer
Location : San Jose CA(Day 1 Onsite)
Duration / Job Type : FullTime
End Client : To be disclosed(Semiconductor Domain)
JD :
Responsible for defining substrate / packagedesign rules process flow and material set for new automotive powermodule packages.
- Drive alignmentbetween module substrate (PCB) design requirements and suppliercapabilities to enable new product development and volumemanufacturing of power modules
- Develop newassembly technologies run process DOEs to define process windowsfor new package development
- Drive reliabilitytesting and qualification of new automotive module packages inconjunction with the reliability group
- Workclosely with offshore assembly and substrate partners to developnew processes
- Work closely with IC designteams to define package design rules and define packages to meettheir requirements
- Collaborate withmultifunctional teams within Power Integrations for successfuldevelopment qualification and production ramp of new moduleproducts
JobRequirements :
- BS Degreein Electrical Engineering / Mechanical Engineering / MaterialScience.
- Minimum experience 12 years insemiconductor packaging technology.
- Experienceleaded multidie packages.
- Understanding oforganic laminate technologies manufacturing and suppliercapabilities.
- Experience in SMT or passiveintegrated package assembly is a plus.
- Experience with packaging processes : Wafer BackgrindingWafer Dicing Die Attach Wirebonding Molding and PackageSingulation. (Flip Chip is a plus)
- Experiencewith package substrate design rules tools (includingAutoCAD).
- Knowledge of AEQ Automotivereliability requirements.
- Knowledge of APQPautomotive development process
- Knowledge ofJEDEC / IPC design standards.
- Ability to setupDesign Rule Checks for verification of every aspect of the PCBlayout a plus.
- Travel to Asia to attendtechnology reviews and resolve subcon / supplier issues
30+ days ago