Must Haves
- Strong understanding in RF / microwave fundamentals such as impedance matching, passive RLC and resonant circuits, noise, linearity, circuit stability and Electromagnetic theory
- Solid understanding in module building blocks, including Power Amplifiers, Low Noise Amplifiers, RF Switches and Couplers, Filters, and Multi-chip Module
- Relevant experience in (micro-strip / strip line stack up) multi-chip module (MCM), PA, LNA , RF switch design or passive circuit design such as integrated passive device, coupler, BAW / SAW filters and balun
- Strong circuit simulation skills utilizing Agilent ADS, 2.5 / 3D EM tools such as ADS Momentum / EMX, HFSS and Cadence and ability to translate between the model, simulation, physical implementation, and measured performance
- Demonstrated lab skills in data collection / analysis, lab debug / tuning and product troubleshooting
- Master's degree in electrical engineering + 3 years’ experience
Plusses
- Knowledge of RF systems and wireless standards (3GPP, WiFi, GPS, Bluetooth).
- Understanding of device and process technologies.
- Experience in system architecture, circuit design, and MCM floor planning.
- FEM product development experience with customer interaction.
- Familiarity with acoustic filters (SAW, BAW).
- Co-simulation expertise in digital, analog, and RF circuits.
- Proficiency with lab equipment such as analyzers, signal generators, and RF probe stations.
What your day will look like
- Participate in all phases of product development, from definition and architecture to design, layout, lab debugging, and production support.
- Lead front-end module design for cellular handsets, collaborating with a multi-disciplinary team on PA, RF switches, LNA, and acoustic filters to optimize module performance.
- Interact directly with customers on Pin I / O, size, and performance specifications, offering suggestions and solutions.
- Oversee floor-planning, including module pinouts, package size, signal flow, and technology link budgets.
- Lead new technology and architecture proposals through comprehensive analysis.
- Enhance design methodologies to improve accuracy and efficiency.
- Drive module design reviews and oversee tapeout.
- Support the development of new packaging technologies.
5 days ago