3D IC Solutions Engineer- Package Design Engineer

SiemensEDA is a global technology leader in electronic design automationsoftware.Our software tools enablecompanies around the world to develop new and highly innovative electronicproducts faster and more cost-effectively.

Our customers use our tools to push the boundaries of technology andphysics in order to deliver better products in the increasingly complex worldof chip, board and system design.

JobOverview

SiemensEDA is seeking a senior level, self-starting, motivated, and high performingindividual for an opportunity to serve as the package design lead in our 3D ICSolutions Engineering team in driving the development of comprehensive, end toend workflow solutions supporting the development of advanced 2.

5 and 3D Systemin Package (SIP) designs. These multi-domain workflow solutions seamlessly integrateSiemens’ industry leading EDA and MCAD tools that facilitate the architecturalplanning, physical design / verification, muti-die based electrical, thermal,mechanical stress analysis and manufacturing test of advanced 2.

5 and 3D System-in-Package(SIP) designs.

Theprimary responsibility for this position will be to drive the development ofworkflows to support the physical design planning, layout, and verification ofadvanced 3D IC designs.

These workflows include package floor planning, package / chipletlevel functional / IO planning, interposer / substrate planning, layout, packagelevel connectivity, Logical Equivalence Checking (LEC), package level 3Dstack(DRC / LVS) verification and physical DRC / DFM verification of the packagecomponents (excluding the chiplet devices).

Additional responsibilities includeworking with the 3D IC Solutions teams in integrating the other 3D IC workflowsinto the 3D IC Physical Design workflow.

Referencedesigns and test structures and / or customer designs will be used in thedevelopment, testing and validation of these workflows.

The package design leadwill also provide technical support and guidance to the sales, marketing designservice organizations as required.

Thisposition may require periodic travel to work with customers in developing andvalidating these workflow solutions.

Requirements

• BSor MS in Electrical / Computer Engineering
• 10 or more years of advanced package physical design and verification experience
• Working knowledge (3-5 years of experience preferred) of Advanced Packaging IC EDA tools and design methods including :

o2.5Dand 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)

oPackageDesign Cadence (APD / SiP), Siemens (XSI / XPD)

oSignal / Powerintegrity analysis : Siemens (HyperLynx SI / PI), Ansys (Redhawk, Totem, Swave),Cadence (Sigrity, Clarity)

• Detailed knowledge of EDA data formats (Verilog, LEF / DEF, GDS, OASIS, etc.).
• Working OS knowledge of Windows and Linux
• Scripting / Programming : Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
• Working knowledge of IC EDA tools and design methods including :

oASICdesign methodology from RTL Synthesis to Physical Implementation phases

oRTLDesign / Verification, LEC, STA analysis

oIntegrationand validation of Silicon-on-Chip IP integration and validation

oPlaceand Route solutions : Siemens (Aprisa, Nitro, Tanner), Synopsys (IC / 3DIC / CustomCompiler), Cadence (SoC Encounter, Innovus, Virtuoso)

oPhysicalVerification : DRC, LVS, IR / EM analysis

oDFTintegration and ATE test support.

Working knowledge of Thermal / Stress analysis and / or optical design tools and design methods a plus, including :

oThermaland / or mechanical stress analysis tools : Siemens (NX, Flowtherm, SimCenter 3D),Ansys (Icepak, Mechanical), Cadence (Celsius)

oOpticaldesign / analysis tools : Siemens (Tanner), Ansys (Lumerical)

Working competency with Microsoft Word, Excel, and PowerPoint.

Why us?

Working at Siemens Software means flexibility - Choosing betweenworking at home and the office at other times is the norm here.

We offer greatbenefits and rewards, as you'd expect from a world leader in industrialsoftware.

A collection of over 377,000 minds building the future, one day ata time in over 200 countries. We're dedicated to equality, and we welcomeapplications that reflect the diversity of the communities we work in.

Allemployment decisions at Siemens are based on qualifications, merit, andbusiness need. Bring your curiosity and creativity and help us shape tomorrow!

Siemens Software. Transform the Everyday

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