Electronics Hardware Packaging Engineer

Komatsu
Warrendale, PA, US
Full-time

Job Overview

Komatsu is an indispensable partner to the construction, mining, forestry, forklift, and industrial machinery markets, maximizing value for customers through innovative solutions.

With a diverse line of products supported by our advanced IoT technologies, regional distribution channels, and a global service network, we tap into the power of data and technology to enhance safety and productivity while optimizing performance.

Komatsu supports a myriad of markets, including housing, infrastructure, water, pipeline, minerals, automobile, aerospace, electronics and medical, through its many brands and subsidiaries, including TimberPro, Joy, P&H, Montabert, Modular Mining Systems, Hensley Industries, NTC, and Gigaphoton.

Key Job Responsibilities

  • Create, refine designs for electronic hardware enclosure packaging for devices including sensors, control and automation hardware for use in hazardous underground mining environment
  • Responsible for choosing appropriate materials for packaging based on electrical, thermal, and mechanical properties as well as cost-effectiveness and manufacturability
  • Engage with an experienced cross-disciplinary team to formulate and design innovative products
  • Support design reviews with internal teams and suppliers
  • Conduct tests to evaluate performance of electronic enclosure packaging designs, including and validation of hardware prior to their release
  • Work with design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly
  • Perform thermal analysis of electronics and design enclosures with proper thermal management to ensure electronic components operate within safe temperature ranges
  • Perform modal and vibration analyses of electronic assemblies with mechanical / structural components
  • Ensure enclosures comply with industry standards and regulations such as IP ratings for ingress protection, and regulatory requirements
  • In addition to electronics packaging, candidate will be responsible for design of test fixtures
  • Support vibration, shock, and thermal tests of products designed
  • Responsible for development of CAD designs, part drawings and assembly drawings
  • Up to 5% of travel is possible

Qualifications / Requirements

  • BS in Mechanical or related degree with 10 years industry experience in designing ruggedized electronics enclosure packaging
  • Design electro-mechanical assemblies that comply with requirements for thermal , EMI / EMC, shock and vibration specifications
  • Experience with modeling PCBA with enclosures
  • Experience with 3D CAD tools such as Autodesk Inventor
  • Experience in building prototype enclosures, configuring, maintaining 3D printers
  • Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes
  • 30+ days ago
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