VP, Wafer Services Business Unit Amkor Technology Enabling the Future

Amkor is recruiting for a Vice President, Wafer Services Business Unit to be based at Amkor’s corporate headquarters in Tempe, AZ.

This position will be a customer facing role and includes cross functional management with responsibility of wafer bumping, wafer level CSP, wafer level fan out, high density fan out, heterogeneous integration, wafer probe and die processing.

The position will include technical, capacity, CapEx, and commercial discussions. Daily interaction with Amkor Sales and Factory teams will be needed to manage customer expectations and requirements.

A business background with previous P&L responsibility is highly desirable.

Below, you will find a complete breakdown of everything required of potential candidates, as well as how to apply Good luck.

This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill.

The selected individual will need to help define and concurrently manage ownership of multiple programs, from both business and technical sides.

Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the package portfolio with key customers to gain business;

travel to Amkor factories and customer locations as needed.

• Proactively drive year-over-year customer revenue growth both within this business unit and within Amkor.
• Work with Amkor’s advanced product development teams on the transfer of new packaging technologies to production; this will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.
• This position will have capacity and planning discussions with customers.
• Being collaborative and having an optimistic, can-do attitude on a daily basis is essential.

Qualifications :

Bachelor’s Degree in Engineering or Science with minimum of 15 years’ experience in semiconductor manufacturing or packaging.

Advanced business degree is desired.

• Exhibit organized technical Project Management experience (preferably, involving off-shore factories) and the ability to multiplex across numerous programs and teams is essential.
• Demonstrated ability to work independently in a heavily matrixed organization; needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role;

assuming ownership of program success is a must.

• Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various wafer bumping.
• Deep understanding of future advanced packaging trends (heterogeneous integration, Chiplets, HDFO, panel based processing, IDM / OSAT capabilities).
• Previous experience in a customer facing business role.
• Proven track record of driving customer revenue increases year over year.
• Requires excellent written and verbal communication skills.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook, Teams) is required.
• This position requires approximately 15% domestic and 15% international travel.

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