Overview
Principal / Senior Principal Microelectronics Electroplating Process Engineer role at Northrop Grumman. The position involves leading and developing wet etch and plating processes for new materials on emerging technologies in microelectronic and superconducting electronics, mentoring engineers, and supporting tool procurement, start-up, and process documentation. The role requires working in a Class 100 cleanroom environment and obtaining / maintaining a Secret clearance.
Responsibilities
- Lead and develop new wet etch and plating processes for new materials on emerging technologies in microelectronic and superconducting electronics.
- Mentor junior engineers to support their career development.
- Procure and start up new semiconductor equipment and processes.
- Develop and maintain process documentation.
- Work with Environmental, Health, and Safety to improve safety of processes, recommend PPE, environmental monitoring, and hazardous waste handling.
- Train technicians and junior engineers on tool operations.
- Interface with customers, program managers, other unit process engineers, and integration engineers during design and execution of process development and improvement projects.
- Perform related duties as assigned.
Qualifications
Basic Qualifications for Principal Microelectronics Electroplating Process Engineer :
Bachelors in Chemical Engineering, Materials Engineering, Chemistry, Physics or related STEM field with 5 years of relevant experience (Masters with 3 years, PhD with 1).Hands-on experience in wafer fab etching and plating tool qualification, process development and tool troubleshooting.Direct experience with semiconductor fabrication, working in an R&D cleanroom or high-volume manufacturing semiconductor environment.Knowledge of analytical techniques and wet solution analysis to monitor and maintain plating baths (e.g., pH, titrations, auto-dosing, inline chemical analysis).Experience with tool purchasing, installation, startup, and qualification.Experience with characterization techniques relevant to plated films.Ability to work independently and provide technical solutions to complex problems.Ability to work a large percentage of time with chemicals in a Class 100 cleanroom.Ability to meet physical and PPE requirements.Responsible for implementing, maintaining, and optimizing SPC process control of plating and etch processes.Experience with structured problem-solving methodology to troubleshoot tool and process issues.Comfortable working around and with a variety of chemicals.Must be a US Citizen and able to obtain / maintain a Secret clearance.Basic Qualifications for Senior Principal Microelectronics Electroplating Process Engineer :
Bachelors in Chemical Engineering, Materials Engineering, Chemistry, Physics or related STEM field with 8 years of relevant experience (Masters with 6 years, PhD with 4 years).Hands-on experience in wafer fab etching and plating tool qualification, process development and tool troubleshooting.Direct experience with semiconductor fabrication, working in an R&D cleanroom or high-volume manufacturing semiconductor environment.Knowledge of analytical techniques and wet solution analysis to monitor and maintain plating baths (e.g., pH, titrations, auto-dosing, inline chemical analysis).Experience with tool purchasing, installation, startup, and qualification.Experience with characterization techniques relevant to plated films.Ability to work independently and provide technical solutions to complex problems.Ability to work a large percentage of time with chemicals in a Class 100 cleanroom.Ability to meet physical and PPE requirements.Responsible for implementing, maintaining, and optimizing SPC process control of plating and etch processes.Experience with structured problem-solving methodology to troubleshoot tool and process issues.Comfortable working around and with a variety of chemicals.Must be a US Citizen and able to obtain / maintain a Secret clearance.Preferred Qualifications
Ability and desire to assume a technical leadership role within the organization.Experience running and owning liftoff, etch, and plating tools (AMAT, Veeco, ClassOne, Technic).Experience with pulse plating.Experience with technology transfers and demonstrated history of innovation.Excellent project management skills with ability to identify manufacturing improvements, manage change, and implement solutions.Secret clearance.J-18808-Ljbffr