Glass Core Technology (GCT) Engineering Development Director

Description

Position at Samtec, Inc

Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packaging.

As we expand our investment in this cutting-edge technology, we are looking for energetic and innovative experts to join our growing team of scientists and engineers developing glass interposers and other novel device fabrication technologies for transparent substrates.

One critical role is for a world-class wafer development engineering director to join the Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana.

The successful candidate will be responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated.

They will work with the engineering, manufacturing, sales and marketing teams to ensure that products being developed for our GCT customers (both internal and external to Samtec) meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products.

THIS POSITION WILL BE ONSITE IN NEW ALBANY, IN

Role Overview : Samtec is seeking a dynamic and visionary Wafer Development Engineering Director to spearhead our Glass Core Technology Development Center and Wafer Fab in New Albany, Indiana.

This pivotal role will lead a team of scientists and engineers dedicated to advancing glass interposers and other innovative device fabrication technologies for transparent substrates.

Why Samtec : Join Samtec at the forefront of innovation in electronic interconnect solutions. We offer a collaborative and inclusive work environment where your ideas and expertise will drive the development of next-generation technologies.

As part of our team, you will have the opportunity to make a significant impact on our global operations and shape the future of electronic packaging solutions. Key Responsibilities :

• Strategic Leadership : Drive the vision and strategy for wafer development, aligning with Samtec's commitment to technological advancement and operational excellence.
• Technical Expertise : Oversee the design, development, and optimization of processes for glass interposers and related technologies, ensuring state-of-the-art solutions that meet stringent performance and reliability standards.
• Team Management : Mentor and guide-lead from the side-a multidisciplinary team of engineers and scientists, fostering a culture of innovation, collaboration, and continuous learning.
• Collaboration and Partnership : Work closely with cross-functional teams across Samtec's global network to integrate cutting-edge technologies into our product portfolio and enhance customer value.
• Research and Development : Lead R&D initiatives to explore and implement next-generation fabrication techniques, leveraging transparent substrates to redefine possibilities in electronic interconnect solutions.

Qualifications :

• Education : Advanced degree in Electrical Engineering, Materials Science, Physics, or related field. PhD preferred.
• Experience : Extensive experience (10+ years) in semiconductor or microelectronics industry with a focus on wafer development, process engineering, and technology transfer.

Experience in glass-based packaging or advanced semiconductor packaging technologies is highly desirable.

• Leadership : Proven track record that includes 5+ years of leading high-performance teams in a technology-driven environment.
• Innovation Mindset : Passion for innovation and disruptive technologies, with a deep understanding of materials science and semiconductor manufacturing processes.
• Communication Skills : Strong interpersonal and communication skills, with the ability to articulate complex technical concepts to diverse stakeholders.
• Technical Skills :
• Expertise with Glass, Silicon, Semiconductor, Silicon Photonics, or Hard drive wafer process development and integration, qualification and high-volume manufacturing are strongly desired.
• Solid Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, dry etch (RIE), ECD Cu plating, final finish plating, electrical test, and characterization is strongly desired.
• Candidate experience must demonstrate success at developing process flows which integrate process modules (lithography, deposition, etch) to deliver new products for customers .
30+ days ago