Job Title : Power Electronics Mechanical Packaging Engineer
Job Description
We are looking for someone that has experience in designing product packages for power electronics. The ideal candidate will design small metal / plastic enclosures that house PCBs, Bus Bars, heatsinks, fans, etc.
Job Responsibilities :
- Work with others to bring our rapid prototype designs to market (creating new 3D Model packaging / layout using SOLIDWORKS).
- Ensure the designs are accurate and consistent with standard manufacturing / assembly processes.
- Maintain revision control for individual components for each part to ensure configuration is controlled at each phase.
- Design HW packaging for high power power electronics in enclosures considering EMC, EMI, thermal, and other requirements.
- Works with system engineering to capture system requirements for utilizing the packages in the system architecture.
- Works with service to create service plans and documentation for maintanence and repair of products.
- Utilizes DFM (Design For Manufacturing) and DFA (Design For Assembly) practices during the design process
Hard Skills
- Power Electronics
- Packaging
- Mechanical Design
- PCBs
- Product Package Design
- 3D Modeling using SOLIDWORKS
- DFM (Design For Manufacturing)
- DFA (Design For Assembly)
Soft Skills
- Collaboration
- Attention to Detail
- Configuration Management
- Understanding of BOM Structure
- System Engineering Coordination
- Vendor Management
Job Type
This is a permanent position.
Work Site
This is a fully on-site position in Franksville, Wisconsin.
Work Environment
This position reports to the HW engineering manager and is based in Franksville with occasional trips to the ATG site in Milwaukee.
You will work closely with the system engineering team to ensure successful integration of products into overall systems.
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