Electron Beam Lithography Engineer / Principal Electron Beam Lithography Engineer - 2nd shift

Requisition ID : R10171757

The following information aims to provide potential candidates with a better understanding of the requirements for this role.

Category : Engineering

Location : Linthicum, Maryland, United States of America

Clearance Type : Top Secret

Telecommute : No - Teleworking not available for this position

Shift : 2nd Shift (United States of America)

Travel Required : Yes, 10% of the Time

Relocation Assistance : Relocation assistance may be available

Positions Available : 1

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history.

We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way.

Our culture thrives on intellectual curiosity, cognitive diversity, and bringing your whole self to work.

The Northrop Grumman Microelectronics Center (NGMC) group is seeking an exceptionally talented and motivated Electron Beam Lithography Engineer.

This position is located at the Advanced Technology Lab (ATL) - just outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor and superconducting products for internal and commercial production, as well as engineering programs.

Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems.

The Ebeam Engineer will work in the coat, expose, and develop modules supporting various production and R&D process areas at ATL.

The selected individual should enjoy hands-on engineering development and production support within our trusted foundry cleanrooms.

The Ebeam Engineer will be responsible for :

• Maintaining production processes including process safety, process control, new process qualifications, technician training, preventative maintenance, tool troubleshooting, and chemical inventory monitoring.
• Coordinating with stakeholders, including equipment vendors, engineering staff, product integration, and program and operations management, to define process needs and establish manufacturing requirements.
• Performing trade studies and submitting costing proposals for the procurement of advanced semiconductor manufacturing equipment.
• Developing new processes for emerging technologies in both microelectronic and superconducting electronics.
• Classifying manufacturing process windows and range of equipment capabilities.
• Writing and maintaining process documentation.
• Performing all other related duties as required.
• Working 2nd shift hours from 2pm-11pm.

Basic Qualifications Electron Beam Lithography Engineer :

• Bachelor of Science degree in Chemical Engineering, Materials Science, Materials Engineering, Electrical Engineering, Chemistry, or related field with 2 or more years of related experience or a Masters Degree with 0 years of experience.
• Hands-on experience in a clean room environment working with Ebeam Lithography tools.
• Proficiency with Microsoft Office.
• Knowledge of statistical process control (SPC).
• Excellent communication skills and the ability to work in a group environment.
• Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.
• Must be able to work 2nd shift from 2pm-11pm.
• The ability to obtain and maintain a Top Secret clearance.
• U.S. Citizenship required.

Basic Qualifications Principal Electron Beam Lithography Engineer :

Bachelor of Science degree in Chemical Engineering, Materials Science, Materials Engineering, Electrical Engineering, Chemistry, or related field with 5 or more years of related experience;

a Masters Degree with 3 years of experience; PhD with 0 years of experience.

• Hands-on experience in a clean room environment working with Ebeam Lithography tools.
• Proficiency with Microsoft Office.
• Knowledge of statistical process control (SPC).
• Excellent communication skills and the ability to work in a group environment.
• Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.
• Must be able to work 2nd shift from 2pm-11pm.
• The ability to obtain and maintain a Top Secret clearance.
• U.S. Citizenship required.

Preferred Qualifications :

• A Masters or PhD degree in one or more of the fields mentioned above.
• Active Secret or higher clearance.
• Extensive experience developing processes.
• Experience operating and troubleshooting the following tools :
• Coater Tracks (positive and negative resists)
• Layout BEAMER Fracture Software
• Leica 5000+ or Raith 5200 Ebeam systems
• CDSEM
• Bash scripting / programming

Salary Range : $83,300 - $124,900

Salary Range 2 : $102,400 - $153,600

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity / Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.

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