Die Attach Operator Level 2 - Swing shift

Job Description

Job Description

Salary is dependent on experience and education.

Integra Technologies is not accepting unsolicited assistance from search firms for this employment opportunity. Please, no phone calls or emails.

All resumes submitted by search firms to any employee at Integra Technologies via email, the Internet, or in any form and / or method without a valid written search agreement in place for this position will be deemed the sole property of Integra Technologies.

No fee will be paid in the event the candidate is hired by Integra Technologies as a result of the referral or through other means.

JOB DESCRIPTION

Job Code : 25550, 25551, 25552, 25553

Reports To : Production Manager

Department Name : 170 - Mfg - Die Attach-Flip Chip

FLSA Status : Non-Exempt

POSITION SUMMARY

Perform automatic and manual die bonding with various equipment that bonds integrated circuit dies to substrates, lead frames and package cavity.

KEY RESPONSIBILITIES / ESSENTIAL FUNCTIONS INCLUDE

Level 1 :

• Operate Stud Pull Test procedure and certified spec.
• Operate Die Shear Process Test Procedure and certified specifications.
• Operate and inspect X-ray.
• Operate XYZ Micro VU measurement tool.
• Recognize and select fixture and tooling.
• Operate UV cure.
• Recall and select profile for die attach reflow on RTC furnace silver glass.
• Recall and select profile for die attach reflow on WJ furnace hermetic and solder paste.
• Recall plasma machine program per traveler instruction.
• Manual silver glass die attach operation.
• Clean procedure (remove flux) bake.
• Manual dam & fill can control fillet around the die given less space on cavity of the package.
• Manual under fill and cure process.
• Operate Flip Chip Attach SEC machine.
• Operate Asymtek dispensing machine old and new version.
• Operate MAT 6400 and Datacon.

Level 2 :

• Mix glass beads in to epoxy follow the mix ration.
• Die attach with customer consigned epoxy (high or low viscosity).
• Manual attach DAP die without epoxy.
• Manual stacks dies attach or components attach.
• Tiny die (less than 0.015 ) use wood stick pickup epoxy for DA. Thin die (less than 0.006 ) use wood stick pickup epoxy for DA.
• Manual or Auto dispense and attach stiffener to device.
• Recall Program Flip Chip Attach SEC machine .
• Recall program on Asymtek dispensing machine old and new version.
• Recall program on MAT 6400.
• Recall program Datacon Operation.
• Recall profile for silver glass reflow on RTC Furnace and Glass Seal.
• Recall profile for die attach reflow on WJ Furnace Hermetic and Solder paste.

Level 3 :

• Select Eutectic Die Attach tooling, setup heat block temperature and operate machine.
• Setup Eutectic Die Attach machine included temperature.
• Operate Eutectic Die Attach manual.
• Setup new program Flip Chip Attach SEC Machine .
• Setup new program on Asymtek dispensing machine old and new version.
• Setup New Program on MAT 6400.
• Setup New Program on Datacon Operation.

Level 4

• Proficient in all department skills.
• Set-up and operate automatic / manual Die Attach, Flip Chip and Dispenses equipment.
• Operate a variety of equipment, including high-powered microscopes, with speed and accuracy.
• Follow job traveler instructions accurately.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE

Education : High School diploma or above required.

Experience :

• 6 months of semiconductor assembly in a Production environment preferred.
• Experience in second optical inspection may be applicable.

Knowledge / Skills :

• Experience with :
• Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.).
• Manual Dam & Fill operation and automatic equipment (Asymtek, etc.)
• Automatic Die Attach bonders (Datacon, MAT6400, etc.)
• Semi-automatic Flip Chip bonders (SEC860, etc.)

SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising : 0

Number of Subordinate Supervisors Reporting to Position : 0

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment.

The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).

PHYSICAL REQUIREMENTS INCLUDE

In an average workday, employee must (check one frequency for each task) :

Task

None

Occasional

Frequent

Constant

Stand

Walk

Bend / stoop

Climb

Reach above shoulders

Squat / crouch / kneel

Push / pull

Lift

Usual amount

11-25 lbs

26-50 lbs

51+ lbs

Carry

Usual amount

11-25 lbs

26-50 lbs

51+ lbs

Employee must use hands for repetitive action such as (please check all) :

Task

Right

Hand

Left

Hand

Simple grasping

Firm grasping

Fine manipulation

WORKING CONDITIONS INCLUDE

In an average workday, employee is exposed to (check one frequency for each task) :

Task

None

Occasional

Frequent

Constant

General shop or store conditions

General office environment

Humid, ext