CMP Process Development Engineer - Packaging

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a CMP packaging process engineer within our Technology Development organization at Micron Technology, you will be part of a world-wide advanced packaging team responsible for next generation high bandwidth memory (HBM) pathfinding and development.

You will be responsible for developing CMP process technology which will enable Micron to develop cutting edge memory technology.

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems.

You will be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC / FDC methodology.

Additional responsibilities include coordinating and carrying out process, equipment and material evaluation / optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities include, but are not limited to :

• Drive design of experiments (DOEs) and analysis with tenacity in creating a process technology path towards definition of leading HBM products in the market
• Collaborate with cross functional teams for demonstration and development of advanced packaging technology
• Engage with external vendors and research partners in expediting the process development schedule
• Model-based problem solving and drive innovation efforts through risk / issues mitigation, patents, and papers
• Identify, diagnose and resolve assembly process related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead / participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and / or materials for new product introduction
• Support SPC / FDC / RMS / APC
• Support site to site process transfers

Minimum Requirements :

• Required : Master's Degree in Chemical Engineering, Mechanical Engineering, Industrial Engineering, physics, chemistry or related field (Ph.D. preferred)
• CMP process development and equipment related experience required
• Prior integration experience of 3D TSV, micro-bumps, temporary bonding / debonding, wafer thinning, BS TSV reveal, RDL, dicing and hybrid bonding is preferred
• Understanding of semiconductor devices, processes, and characterization techniques is preferred
• Basic understanding of Customer needs with a focus in the Memory segment
• Oral and written English communication

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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