Associate Process Engineer (Laser Diode Packaging)

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.

Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible.

Our employees are not only part of history, they're making history.

Scroll down for a complete overview of what this job will require Are you the right candidate for this opportunity

An organization within Northrop Grumman Space Systems' Payload and Ground Systems (PGS) division, Cutting Edge Optronics is a leading provider of high-power laser diode arrays, high power pump modules and diode-pumped solid-state (DPSS) lasers.

We are a vertically integrated manufacturer capable of supplying unmounted diode bars, packaged laser diodes, DPSS modules, laser diode drivers and complete DPSS laser systems.

Our diode laser-based products have become industry standards and are used in a wide variety of commercial and military applications.

Job Duties :

• Develop new manufacturing processes associated with the packaging / soldering of semiconductor laser diodes.
• Responsible for laser diode array packaging and testing processes.
• Assist with the automation of packaging, testing, and inspection operations.
• Support existing manufacturing processes through hands-on interaction with operators, monitoring of yield and quality metrics, and other continuous improvement activities.
• Interface with material suppliers and supervise the fabrication of prototypes.

Basic Qualifications :

• Bachelor's degree in engineering, Physics, or Material Science is required.
• General understanding of manufacturing processes.
• Familiarity with Design of Experiments methodologies.
• Experience with semiconductor packaging, specifically eutectic solder attach, reflow ovens, and automated bonders is preferred.
• Hands-on laboratory experience.

Salary Range : $58,000 - $87,000

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity / Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.

For our complete EEO / AA and Pay Transparency statement, please visit http : / / www.northropgrumman.com / EEO. U.S. Citizenship is required for most positions.

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