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Postdoctoral Fellow (multiple openings)

Postdoctoral Fellow (multiple openings)

Georgia TechAtlanta, Georgia, United States
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Job ID

288562

Location

Atlanta, Georgia

Full / Part Time

Full-Time

Regular / Temporary

Regular

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About Us

Overview

Georgia Tech prides itself on its technological resources, collaborations, high-quality student body, and its commitment to building an outstanding and diverse community of learning, discovery, and creation. We strongly encourage applicants whose values align with our institutional values, as outlined in our Strategic Plan. These values include academic excellence, diversity of thought and experience, inquiry and innovation, collaboration and community, and ethical behavior and stewardship. Georgia Tech has policies to promote a healthy work-life balance and is aware that attracting faculty may require meeting the needs of two careers.

About Georgia Tech

Georgia Tech is a top-ranked public research university situated in the heart of Atlanta, a diverse and vibrant city with numerous economic and cultural strengths. The Institute serves more than 45,000 students through top-ranked undergraduate, graduate, and executive programs in engineering, computing, science, business, design, and liberal arts. Georgia Tech's faculty attracted more than $1.4 billion in research awards this past year in fields ranging from biomedical technology to artificial intelligence, energy, sustainability, semiconductors, neuroscience, and national security. Georgia Tech ranks among the nation's top 20 universities for research and development spending and No. 1 among institutions without a medical school.

Georgia Tech's Mission and Values

Georgia Tech's mission is to develop leaders who advance technology and improve the human condition. The Institute has nine key values that are foundational to everything we do :

Students are our top priority.

We strive for excellence.

We thrive on diversity.

We celebrate collaboration.

We champion innovation.

We safeguard freedom of inquiry and expression.

We nurture the wellbeing of our community.

We act ethically.

We are responsible stewards.

Over the next decade, Georgia Tech will become an example of inclusive innovation, a leading technological research university of unmatched scale, relentlessly committed to serving the public good; breaking new ground in addressing the biggest local, national, and global challenges and opportunities of our time; making technology broadly accessible; and developing exceptional, principled leaders from all backgrounds ready to produce novel ideas and create solutions with real human impact.

About the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology

The Woodruff School graduates high caliber mechanical engineers for a demanding profession. Mechanical engineers are the foundation of today's technological world. To do so, we provide enhanced facilities and laboratories to create the best learning environment and we attract outstanding faculty and students. In this period of rapid technological change, the Woodruff School produces mechanical engineers who are vital to our future. With approximately 3,000 students,100 faculty members, and 70 staff members, we are one of the largest mechanical engineering programs in the country. We are consistently ranked as one of the top 10 mechanical engineering programs in the U.S. at both the graduate and undergraduate levels and continuously innovate to keep our school at the forefront of engineering education. Our size and resources allow us to offer a variety of educational and research opportunities that enable us to produce highly sought after engineering professionals.

Location

This is not a supervisory position.

This position does not have any financial responsibilities.

This position will not be required to drive.

This role is not considered a position of trust.

This position does not require a purchasing card (P-Card).

This position will not travel.

This position does not require security clearance.

This position is located in Atlanta, GA

This position is 100% supported by sponsored funds.

Job Summary

Georgia Tech is at the forefront of advancing semiconductor technologies, particularly in the areas of glass-core packaging and 3D heterogeneous integration. As part of our mission, we aim to bridge the gap between academia and industry, driving innovation while fostering the development of the next generation of engineers and scientists. We are currently seeking highly motivated Post-Doctoral Fellows to contribute to groundbreaking research and collaborate with academic institutions, industry partners, and students in these exciting and rapidly evolving fields.

Job Summary :

We are seeking multiple researchers with expertise in two key areas of advanced packaging :

Glass-Core Packaging

3D Heterogeneous Integration

These positions offer a unique opportunity to conduct cutting-edge research, work closely with graduate and undergraduate students, and collaborate with industry and academic partners. The position holders will contribute to advancing technologies that enable next-generation electronics while documenting their research progress and reporting to sponsors.

General Responsibilities (for all technical areas) :

Mentoring Students : Collaborate with and mentor graduate and undergraduate students in both research and development activities, enhancing their learning and fostering their growth in advanced packaging technologies.

Industry & Academic Collaboration : Work closely with academic institutions, industry partners, and external collaborators to ensure research is relevant and applicable to real-world applications.

Research Documentation and Reporting : Maintain comprehensive records of research, including experimental data, design changes, and results. Provide clear, concise reports to sponsors and stakeholders according to a strict set of timelines.

Sponsor Reporting : Provide timely and thorough updates to project sponsors, ensuring alignment with contractual expectations and deliverables. This includes presenting to sponsors and technical community on findings.

Cross-Disciplinary Teamwork : Work in close coordination with other researchers, engineers, and external partners to drive innovation and progress in your respective focus areas.

Scholarly Publications : Advance foundational science and publish scholarly articles.

Responsibilities

Job Key Technical Responsibilities :

Glass-Core Microstructuring : Develop and implement new techniques for microstructuring glass cores for advanced packaging applications.

Multilayer High-Density Interconnect Fabrication : Design, fabricate, and characterize high-density interconnects for glass-core packaging.

Thermo-Mechanical Modeling and Experimental Validation : Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures.

Computational Mechanics : Develop multi-scale and multi-physics numerical models consisting of metal, polymer, ceramic, and other electronic packaging materials, and offer insight into interlayer delamination, cracking, and warpage under monotonic and fatigue loading conditions.

Characterization and Reliability Assessment : Characterize materials, interfaces, and samples for thermo-mechanical properties, determine process-induced defects, perform application-relevant reliability experiments, and conduct failure analyses.

Area 2 (multiple openings) : 3D Heterogeneous Integration Focus

Job Key Technical Responsibilities :

Compound Semiconductor and Si Stacking, Fabrication, and mechanical Characterization : Design and fabricate TSVs for 3D integration, understand compound semiconductor stacking, and conduct mechanical characterization to validate performance.

Thermo-Mechanical Modeling and Experimental Validation : Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures.

Computational Mechanics : Develop multi-scale and multi-physics numerical models consisting of metal, polymer, ceramic, and other electronic packaging materials, and offer insight into interlayer delamination, cracking, and warpage under monotonic and fatigue loading conditions.

Characterization and Reliability Assessment : Characterize materials, interfaces, and samples for thermo-mechanical properties, determine process-induced defects, perform application-relevant reliability experiments, and conduct failure analyses.

Advanced Bonding and Assembly Technologies for 3D Chip Stacks : Develop and apply novel bonding and assembly methods for 3D chip stacking, enhancing performance and reliability.

Required Qualifications

A doctoral degree in Engineering or related fields.

Preferred Qualifications

PhD in Mechanical Engineering or Materials Science and Engineering or a closely related field.

Knowledge, Skills, & Abilities

Skills for mentoring students at the undergraduate and graduate level, while also collaborating with academic and industry partners.

Excellent documentation and reporting skills.

Excellent written and verbal communication skills, including the ability to prepare technical reports and presentations

Contact Information

Applicants may submit optional two-page research document indicating the area you are interested in and explaining how the candidate's background is suitable for the positions.

Please contact Ms. Shin Ae Cho at for additional information.

USG Core Values

The University System of Georgia is comprised of our 26 institutions of higher education and learning as well as the System Office. Our USG Statement of Core Values are Integrity, Excellence, Accountability, and Respect. These values serve as the foundation for all that we do as an organization, and each USG community member is responsible for demonstrating and upholding these standards. More details on the USG Statement of Core Values and Code of Conduct are available in USG Board Policy 8.2.18.1.2 and can be found on-line at policymanual / section8 / C224 / #p8.2.18_personnel_conduct.

Additionally, USG supports Freedom of Expression as stated in Board Policy 6.5 Freedom of Expression and Academic Freedom found on-line at policymanual / section6 / C2653.

Equal Employment Opportunity

The Georgia Institute of Technology (Georgia Tech) is an Equal Employment Opportunity Employer. The University is committed to maintaining a fair and respectful environment for all. To that end, and in accordance with federal and state law, Board of Regents policy, and University policy, Georgia Tech provides equal opportunity to all faculty, staff, students, and all other members of the Georgia Tech community, including applicants for admission and / or employment, contractors, volunteers, and participants in institutional programs, activities, or services. Georgia Tech complies with all applicable laws and regulations governing equal opportunity in the workplace and in educational activities.

Georgia Tech prohibits discrimination, including discriminatory harassment, on the basis of race, ethnicity, ancestry, color, religion, sex (including pregnancy), sexual orientation, gender identity, gender expression, national origin, age, disability, genetics, or veteran status in its programs, activities, employment, and admissions. This prohibition applies to faculty, staff, students, and all other members of the Georgia Tech community, including affiliates, invitees, and guests. Further, Georgia Tech prohibits citizenship status, immigration status, and national origin discrimination in hiring, firing, and recruitment, except where such restrictions are required in order to comply with law, regulation, executive order, or Attorney General directive, or where they are required by Federal, State, or local government contract.

More information on these policies can be found here : policymanual / section6 / c2714 Board of Regents Policy Manual | University System of Georgia (usg.edu).

Background Check

Background Check

Successful candidate must be able to pass a background check. Please visit employment / pre-employment-screening

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