Principal/Sr. Principal Engineer RF Microwave Design

Requisition ID : R10169829

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.

Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work and we have an insatiable drive to do what others think is impossible.

Our employees are not only part of history, they're making history.

AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design.

What You’ll get to Do :

• Designing, modeling, and verifying RF / microwave, and mixed signal assemblies and subsystems
• Utilize analysis, simulations and prototyping to develop antenna and signal conversion designs
• Deriving and trading requirements with components, assembly and subsystem engineers
• Performing electromagnetic simulation of component, assembly, and subsystem level performance
• Managing RF budgets, frequency planning, and common assembly level interfaces
• Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
• Develop custom RF integrated circuit designs to meet assembly and subsystem level requirements
• Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
• Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
• Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
• Supporting products throughout the product life cycle (EMD, production, sustainment, DMS)
• RF and mixed signal assembly product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assemblies
• RF and mixed signal subsystem product types include antenna and receiver / exciter subsystems

This requisition may be filled as a Principal Engineer or a Sr. Principal Engineer.

Principal Engineer Basic Qualifications :

Electrical Engineering or related STEM field degree : Bachelor of Science with 5 years of RF / microwave experience; Masters degree with 3 years of RF / microwave experience;

or PhD degree. an additional 4 years of experience will be considered in lieu of a degree

• US Citizenship is required
• Must have Full Secret Clearance Minimum Prior to start
• Ability to provide sound solutions to a broad variety of RF / Microwave design and test related problems of complex difficulty.

Solutions are imaginative, thorough, and practical.

• Developing subject matter expertise in one or more areas of RF / Microwave discipline including but not limited to : RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
• Exhibit intermediate to expert proficiency with industry standard RF / Microwave modeling, simulation and printed circuit board design tools (i.

e. ANSYS HFSS / Maxwell, CST Microwave, Eagleware / Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)

Proven knowledge of electrical engineering design software and equipment

Senior Principal Engineer Basic Qualifications :

Electrical Engineering or related STEM field degree : Bachelor of Science with 8 years of RF / microwave experience; Masters degree with 6 years of RF / microwave experience;

PhD degree with 3 years of experience. An additional 4 years of experience will be considered in lieu of a degree.

• US Citizenship is required.
• Must have Full Secret Clearance Minimum Prior to start
• Ability to provide innovative solutions to a broad variety of RF / Microwave design and test related problems of complex difficulty.

Solutions are imaginative, thorough, and practical.

• Demonstrated subject matter expertise in one or more areas of RF / Microwave discipline including but not limited to : RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
• Exhibit expert proficiency with industry standard RF / Microwave modeling, simulation and printed circuit board design tools (i.

e. ANSYS HFSS / Maxwell, CST Microwave, Eagleware / Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)

Expert knowledge of electrical engineering design software and equipment.

Preferred Qualifications for both Principal and Senior Principal roles :

• Top Secret / SCI security clearance
• RF and mixed signal printed circuit board and circuit card assembly and subsystem level designs
• RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis
• Component selection and / or custom component requirements flow down and trades
• Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
• Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
• RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.
• Antenna Range Testing
• Electronic troubleshooting from component to assembly / subsystem levels
• Complex data reduction and analysis
• Product life cycle support from concept through production support
• Designing for high reliability, mil / aero requirements and environments
• AESA / phased array, Receiver / Exciter, Digital Arrays, Radar, SIGINT, or SATCOM experience
• Technical team leadership
• Experience in the Aerospace or Defense Industry
• Software tools : Mentor Xpedition DX Designer, ANSYS HFSS, CST Microwave, FEKO, TICRA, Keysight ADS, Keysight Genesys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)

This role is contingent upon a Final Clearance to start.

Salary Range : $102,400 - $153,600 Salary Range 2 : $127,000 - $190,600The above salary range represents a general guideline;

however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results.

Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and / or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce.