Process Engineer

Summary

Objective : The process engineer works with internal production, other engineers, suppliers, and customers to deliver high quality, high yielding, and manufacturable solutions for the assembly of optical transceivers.

Key process and equipment areas include but are not limited to die attach (epoxy attach, thermocompression bonding, thermosonic bonding), wire bonding, dicing, epoxy dispensing, metrology, and defect inspection.

Essential Functions / Responsibilities :

• Responsible for products and processes transferred from development to production
• Plans and manages continuous improvement activities for assigned products, processes and equipment
• Technical expert for processes and equipment
• Ensures that documentation and methods are in place to support operations
• Reviews output data from process and implements changes to meet desired yield targets and statistical process metrics
• Create DOE’s and experiments to optimize parameters and improve process yields and product reliability
• Guides and manages tooling and spare parts for processes and equipment
• Participates and drives FMEA and PFMEAs where applicable
• Must be able to work independently and interact with colleagues, customers and vendors as necessary to achieve program objectives
• Work in a cleanroom manufacturing environment, assisting and observing operators and technicians maintaining processes and equipment
• Performs and improves preventative maintenance procedures for equipment

Required Experience :

5+ years of semiconductor, optoelectronics or microelectronics packaging process and equipment engineering experience.

Die bonding experience is strongly preferred

• Materials used for standard package technology, PCBA, Optoelectronics, and assorted substrates.
• Demonstrated experience in assembly process development and improvement
• Ability to meet International Traffic in Arms Regulations (ITAR) compliance requirements
• Hands-on experience of the equipment and materials that are used in the industry.
• Hands-on experience operating equipment to perform a specific process.
• Demonstrated experience in problem-solving and root cause analysis.
• MS Office Excel, Powerpoint, Word and Sharepoint proficiency is required
• Experience in DOE and data analysis software, like JMP, is preferred.
• Experience in microelectronic / microsystem package design and SolidWorks, AutoCAD, or other engineering design, modeling or simulation software is desirable.
• Excellent written and verbal communication skills with ability to frame the topic for easy understanding, propose constructive ideas, and communicate can do attitude.
• Must be a self-starter with strong leadership skills.
• Excellent interpersonal skills in relating to positively engage with both internal and external customers.
• Personal flexibility is necessary to ensure efficient execution of the plan and teamwork.

Preferred Education :

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Chemical, Material Science) or equivalent is required.
30+ days ago