Microwave & Sensor Electrical Engineer

Overview

Job Summary :

Qualified applicants must be a US citizen, at least 18 years of age, and able to meet pre-employment requirements including any required physicals, drug screen, and / or background investigation to satisfy clearance requirements from the Department of Energy.

The RF Microsystems department performs research, design, modeling, characterization, and qualification of RF microelectronics.

We have a focus on efficient, high performance RF component design, electromagnetic modeling, as well as novel wireless sensor development.

We have capabilities for developing prototypes to fully qualified hardware. We provide unique solutions to our customers in nuclear weapons, DoD, non-proliferation agencies, and subsystem departments (SAR, surety, & ISR).

Our research interests include advanced RF sensors, low power communication devices, quantum computing electromagnetics, advanced radar component design, and next generation resonators for clocks unique to national security applications.

Join this team to make a difference for our nation and work toward your individual goals.

Are you looking for an opportunity to contribute to a highly motivated team focused on delivering qualified electronic components to a national security mission?

The RF Microsystems department (5211) is seeking a mid-career R&D Microwave and Sensor Engineer to design, fabrication, test, qualification and delivery of custom designed microwave components.

These components enable military communication systems, SAR imaging and doppler radar, and tagging tracking and locating hardware.

Our team is looking for a driven RF engineer capable of fundamental electromagnetic modeling, transistor level circuit simulation, and distributed element microwave PCB design.

It is also important to understand electronic die characterization, RF test equipment, working knowledge of solder assembly, PCB development and fabrication.

Special Requirements for MedPEDs

If you have a Medical Portable Electronic Device (MedPED), such as a pacemaker, defibrillator, drug-releasing pump, hearing aids, or diagnostic equipment and other equipment for measuring, monitoring, and recording body functions such as heartbeat and brain waves, if employed by Sub-contractor you may be required to comply with NNSA security requirements for MedPEDs.

If you have a MedPED and you are selected for an on-site interview at Sub-contractor, there may be additional steps necessary to ensure compliance with NNSA security requirements prior to the interview date.

Responsibilities

Job Responsibilities :

Uses circuit modeling tools to design analog or RF integrated circuit components for transceivers including analog, mixed-signal, and RF components.

Reviews / Writes specifications for radar component design

Specifies fabrication steps to build custom designed printed circuit boards to test integrated circuit components

Troubleshoots analog or RF circuits in a innovative electronics lab

Characterizes custom designed RF components and modules overvoltage, temperature, and environmental stresses.

Contributes to developing new ideas and proposals for research activities for the department.

Uses electronic equipment to measure slew rate, gain, stability, phase noise, jitter, s-parameters, power output, P1dB, PSat, noise figure, module

Qualifications

Minimum Qualifications :

Master’s in Electrical Engineering or; Bachelor’s in Electrical Engineering plus four (4) years’ experience

Radio Frequency design experience

Electrical test and measure practices to protect sensitive devices and equipment to troubleshooting high frequency circuitry

Use of RF test equipment such as spectrum analyzers, vector network analyzers, pulsed signal generators, oscilloscopes, and precision power supplies.

Ability to acquire and maintain a DOE Q clearance

Desired Qualifications :

Knowledge of designing distributed element active microwave circuits such as detectors, receivers, and power amplifiers

Strong written and presentation skills to provide sponsors and vendors convincing evidence of quality designs

Ability to work independently and within a multi-disciplinary team of peers to meet specifications

Strong interpersonal skills which include teamwork, effective leadership, negotiation, delegation, and conflict resolution

Understanding of : fabrication process for printed circuit boards; die attaching, wirebonding, and packaging; advanced automated assembly processes for die and very small SMT components

Strong electrical test and measure skills at the module and die level

Experience : developing complex microsystem solutions including analog, digital, RF, and other technologies modeling electromagnetic effects on and off die

Active DOE Q or DOD TS clearance

Job : Security, Intelligence & Defense Analysis

Travel : None

Organization : AIS - Akima Infrastructure Services

Clearance : Able to Obtain DOE Q

Work Type : On-Site

Remote : No

ReqID : 2024-11407