Packaging jobs in Milpitas, CA

Summary Posted. Aug 8, 2024 Role Number. 200449884 Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At ..

SEG Packaging is a key part of the HW Technologies team, this team invents, designs, develops and.. As a DRAM packaging engineer, you will lead the memory package development by managing the external..

The ideal candidate will oversee the creative process for print and 3D packaging, ensuring all design.. Handle projects related to packaging, design, and retail displays that range from moderate to intricate..

Opto mechanical design of packaging for Avicena's innovative optical interconnects. Design and test.. Evaluate packaging solutions from concept to volume production to meet performance, reliability..

IC Packaging Lead. Mountain View Acceler8 Talent is seeking a Packaging Design Lead to join an exciting.. As an Packaging Lead you will lead the planning, analysis, and integration of advanced packaging..

A company is looking for a Vice President, Pricing & Packaging. Key Responsibilities. Develop and implement pricing strategies to achieve business goals Conduct market and competitive analysis..

2,715.00 202,200.00 Business Function. Packaging Engineering Company Description At Western Digital.. Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging..

CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Are you the right applicant for this opportunity Find out by..

SEG Packaging is a key part of the HW Technologies team. this team invents, designs, develops, and.. As a DRAM packaging engineer, you will lead the memory package development by managing the external..

Support packaging needs from early concept through to end of life.Design packaging solutions that meet.. Minimum BS Packaging Engineering, Mechanical Engineering, Industrial Engineering or applicable technical..

Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging.. Proficient understanding of packaging domains such as SMT, PCBA, solder joint reliability, board level..

Job Overview. Arm has a great opportunity for a Principal Packaging Architect in our System Integration.. You will play a key role in identifying key packaging technologies, establishing 3rd party..

Possible temp to direct Pay. 50.00. 75.00 DOE Work on site in Santa Clara Expertise in IQ OQ PQ, bubble testing and test method validation Prefer packaging validation experience with ISO 11607..

Louis) and Santa Clara, CA offices. Job Description In photonics, the packaging design is as crucial as.. Responsibilities include. Conceive novel concepts for low loss and low cost fiber packaging through..

CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Key attributes of a successful candidate. Domain expertise in..