Failure Analysis Engineering Manager

Job Description

Job Description

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Failure Analysis Engineering Manager to lead failure analysis investigations on PCB / PCBA reliability issues and manage laboratory operations and reporting activities . Once a part of the team, you will be responsible for a wide variety of tasks within the Operations Department in a lab and production-support environment and have the opportunity to display strong technical and leadership skills to expand your career in Smart Manufacturing.

The Failure Analysis Engineering Manager will oversee comprehensive testing and reporting activities, manage a team of engineers and technicians, and drive the development of new methods and analytical capabilities while assisting the Operations Department as needed.

Job Responsibilities :

Manage and oversee failure analysis investigations on PCBs and PCBAs, including solder joint, component, and environmental testing failures.

Operate, supervise, and expand the use of failure analysis and material testing equipment , ensuring timely and accurate reporting.

Summarize, analyze, and record test results, preparing formal reports for customers and internal global teams.

Develop and maintain laboratory documentation (procedures, best practices, monthly reports, ROI justifications).

Lead road mapping projects to discover, develop, and deploy new methods and testing capabilities.

Support materials consultation activities, including requirements review, specification creation, supplier quality support, and quality administration.

Perform and oversee teardown of mechanical and electronic assemblies for lab analysis while preserving areas of interest.

Conduct visual examinations of PCBAs for tin whiskers, dendritic growth, cracking, corrosion, contamination, and related failure mechanisms.

Provide leadership, training, and oversight to FA engineers and technicians across multiple shifts.

Maintain compliance with IPC, JEDEC, ISO / IEC 17025 , and other applicable standards.

Foster a Safety First culture and ensure compliance with internal and external policies.

Perform other duties as assigned.

Qualifications :

Experience required :

10+ years of experience in PCBs, PCBAs, or electronic packaging.

5–8 years of experience in PCBA failure analysis (PCB failures, component failures, solder joint failure analysis, environmental testing, materials testing, contamination analysis).

Education required : Bachelor of Science in Electronics Engineering, Electrical Engineering (major in Electronics or Microelectronics), Materials Science Engineering, Chemical Engineering, Chemistry, Mechanical Engineering, Metallurgical Engineering, or Physics.

Technical skills required :

Proficiency with destructive and nondestructive metrologies (Dye and Pull, Cross-Section, SEM / EDX, 2D / 3D X-Ray imaging, CSAM, FTIR, XRF, OMM / CMM, Shadow Moiré, Electrical Continuity).

Strong knowledge of IPC and JEDEC standards.

Familiarity with laboratory standards such as ISO / IEC 17025 .

Ability to deduce failure mechanisms from failure signatures.

Preferred skills : Background in semiconductor wafer fabrication, assembly, test, and design; ability to interpret circuit schematics (wafer or board level).

Leadership and soft skills :

Strong problem-solving, organizational, and project management skills.

Ability to manage multiple projects and lead a cross-shift engineering team.

Excellent communication skills, both written and verbal, with strong report writing.

High level of integrity, professionalism, and motivation to drive continuous improvement.

Physical requirements :

Ability to sit at a desk and computer for extended periods.

Ability to travel by air or car for extended periods.

Ability to lift up to 40 lbs.

Reasons you should work for us :

Comprehensive benefits package including medical, dental, and vision insurance coverage.

Basic life insurance and short-term disability coverage provided by employer.

Supplemental life insurance and long-term disability coverage options available.

401K with employer contribution.

Personal, Vacation, and Holiday paid time off for all full-time employees.

Onsite Aurora Health & Wellness Center available for all employees.

Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

About FII USA, Inc., a Foxconn Technology Group Company :

FII USA, Inc, a Foxconn Technology Group Company, is a global leader in smart manufacturing and industrial internet services. With a strong presence in the digital economy, we offer a comprehensive range of solutions in cloud computing, industrial internet, smart home, 5G, and network communication equipment. Fueled by continuous innovation and a commitment to sustainable development, we have become a key player in the electronic manufacturing service industry and sit at the forefront of driving advanced industry development.

FII USA, Inc is an Equal Opportunity employer. All qualified applicants will receive consideration for employment, without regard to sex, race, color, religion, national origin, age, marital status, political affiliation, sexual orientation, gender identity, genetic information, disability or protected veteran status. We are committed to providing a workplace free of any discrimination or harassment.

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