Must Have Technical / Functional Skills
- Bachelor’s in electrical / Electronics Engineering or related required. Master's Preferred
- 5+ years of experience in failure analysis field (preferably semiconductor).
- Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
- Should have good knowledge and understanding of the Failure Analysis Techniques used in the nanometer semiconductor manufacturing technologies like 14nm, 10nm, 7nm, etc.
- Knowledge on FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is required.
- Fundamental knowledge of fault isolation technique, ATE, Scan / ATPG debug preferred.
- Good understanding of transistor functions and basic electronics.
- Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
- Innovative and Creative with troubleshooting techniques.
- Enjoy hands-on work and working in a lab environment.
- Good customer and vendor management skills.
- Ability to work well in cross-functional teams in a fast-paced, collaborative team environment.
- Ability to work independently, multi-task, and pay good attention to details.
Experience Required
5+ years of experience in failure analysis field (preferably semiconductor), Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
Roles & Responsibilities
- Conduct Root cause analysis of reliability tests or field failures and propose corrective act ions.
- Develop and implement standard processes for failure analysis.
- Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way.
- Document and report failure analysis results to management.
- Function as a technical resource for failure analysis questions.
- Develop and maintain relationships with vendors and suppliers.
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