R&D Engineering, Executive Director

Executive Director of R&D for 3D IC Design & Advanced Packaging

51102BR

USA - California - Mountain View / Sunnyvale, USA - Texas - Austin

Job Description and Requirements

We Are :

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines.

We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content.

Our Silicon IP business is all about integrating more capabilities into an SoC-faster. We offer the world's broadest portfolio of silicon IP-predesigned blocks of logic, memory, interfaces, analog, security, and embedded processors.

All to help customers integrate more capabilities. Meet unique performance, power, and size requirements of their target applications.

And get differentiated products to market quickly with reduced risk. Join us to transform the future through continuous technological innovation.

You Are :

You are an experienced leader with a deep understanding of IC design and semiconductor packaging. With over 15 years in the semiconductor industry, you have a proven record of leadership and project management.

You thrive in a collaborative, international, and team-oriented environment. Your exceptional communication skills and customer-centric mindset enable you to drive cross-functional collaboration and deliver innovative solutions.

You embody a supportive and inspirational leadership style, always aiming to exceed expectations.

What You'll Be Doing :

• Leading and overseeing 3DIC Silicon IP & advanced packaging design and verification activities such as layout, simulations, physical design, signal & power integrity, thermal management, and mechanical integrity.
• Managing cross-functional collaboration with EDA tool development, Go-To-Market strategies, and Customer Success in utilizing Synopsys solutions.
• Keeping track of industry trends in the fast-changing field of 3DIC and semiconductor packaging to drive new product innovations.
• Ensuring developed solutions are in alignment with business objectives while delivering differentiated solutions.
• Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.
• Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.

The Impact You Will Have :

• Driving the strategic technology development, planning, and execution of Silicon IP for 3DIC and advanced packaging solutions.
• Influencing and shaping the direction of Synopsys' product offerings in the semiconductor industry.
• Ensuring Synopsys remains at the forefront of innovation in 3DIC and semiconductor packaging technologies.
• Enhancing customer satisfaction by delivering state-of-the-art solutions that meet their needs.
• Contributing to the overall success and growth of Synopsys by leading high-impact projects.
• Fostering a culture of excellence and continuous improvement within your team.

What You'll Need :

• B.S. / M.S. in Electrical Engineering or a related technical discipline, or equivalent experience.
• 15+ years of semiconductor industry experience, including extensive knowledge of semiconductor packaging technologies.
• Proven record of leadership and project management in the semiconductor industry.
• Exceptional verbal / written communication, leadership, face-to-face, and team partnership work skills.
• A customer-centric mindset and a passion for innovation.

Who You Are :

• A visionary leader who can inspire and motivate teams to achieve exceptional results.
• An excellent communicator with the ability to articulate complex technical concepts to diverse audiences.
• A strategic thinker with a keen understanding of industry trends and market dynamics.
• A collaborative team player who thrives in a matrixed, international environment.
• A problem-solver with a proactive approach to overcoming challenges.
• An advocate for continuous improvement and innovation.

The Team You'll Be A Part Of :

You will be part of a highly skilled and motivated team focused on driving innovation in 3DIC and advanced packaging solutions.

Our team collaborates closely with various departments, including EDA tool development, Go-To-Market strategies, and Customer Success, to deliver state-of-the-art solutions that meet our customers' needs.

Together, we strive to push the boundaries of technology and make a significant impact on the semiconductor industry.

Rewards and Benefits :

The base salary range across the U.S. for this role is between $242,000-$362,000. In addition, this role may be eligible for an annual bonus, equity, and other discretionary bonuses.

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings.

Your recruiter will provide more details about the salary range and benefits during the hiring process.

Inclusion and Diversity :

Synopsys considers all applicants for employment without regard to race, color, religion, sex, gender preference, national origin, age, disability, or status as a Covered Veteran in accordance with federal law.

Job Category

Engineering

Country

United States

Job Subcategory

R&D Engineering

Hire Type

Employee

Base Salary Range

$242,000-$362,000